Reliability Test

Test Method

１

The sample disposition

（１）．Solder dipping
（２）．Wave soldering
（３）．High humidty Storage
（４）．Hot temperature and high humidity Storage
（５）．Pressure-cooker test (saturated / unsaturated)

２

Measurement of thermal resistance

（１）．Measurement of thermal resistance (used airstream chamber)
（２）．Simulation of thermal chamber (measurement data analysis)

３

Thermal environmental test

（１）．Resistance of soldering Heat
（２）．Thermal shock (liquid / Vaper phase)
（３）．Temperature cycle
（４）．Moisture cycle
（５）．Temperature characteristics test

４

Mechanical test

（１）．Vibration / Mechanical shock test
（２）．Tension test of lead
（３）．Bending stress test of lead
（４）．Share strength test

５

Life test

（１）．Steady-state Operating Life Test / Intermittent Operating Life Test
（２）．High temperature Storage
（３）．Low temperature Storage
（４）．High temperature and High humidity Storage
（５）．Pressure Cooker (saturated /unsaturated)
（６）．Temperature Reverse-Biase
（７）．Temperature Humidity Reverse-Bias

６

Mountability test

（１）．Solder paste printing (used screen mask)
（２）．BGA package mounting
（３）．IR reflow

７

Electrical test

（１）．ESD resistance (EIAJ method)
（２）．Latch-up test

８

EMC
(Electro-magnetic compatibility)

（Electro-Magnetic-Compatibility）

（１）．EMI (Electro-magnetic interference)
（２）．EMS (Electro-magnetic susceptibility

９

Test report

（１）．Data analysis (Life acceleration analysis, failure rate analysis)
（２）．Physical analysis for failure sample appeared after any tests