Product appearance check

Product appearance observation by the optical microscope

Open/short check

Open and shorted Leads investigation

Leak of Leads investigation

the Voltage-proof check of Leads protection / output circuit

Electrical property check (Go - No-Go)

Quality judgment
Measurement of LOG data

Electrical property check (detailed evaluation)

Voltage / frequency operation margin evaluation

Temperature characteristic evaluation (-70℃ - 225℃)
Test data recombination / detailed evaluation
Data extraction / analysis

Electrical property check (used Probe)

Measurement used Manual Probe

Electrical property check（others）

Parameter measurement using various measuring instruments

Logic analysis

LOG data decipherment
Narrow failure part down (*1)

X-ray fluoroscopy investigation

Inner lead bonding wire form investigation
Die position / paste coverage investigation
Internal void investigation
Length measurement using x-ray

Package opening processing

Opening of IC sealed by plastic
Opening of IC sealed by glass
Opening of IC sealed by metal welding
Opening of COB / opening of card IC
Opening of BGA (by hot sulfuric acid)

Tip appearance observation

Appearance observation of the tip by the optical microscope
Length / Thickness measurement (focal method)

Analysis of the liquid crystal applying method

Inquiry of the current leak part by the liquid crystal applying method

Low sensitivity emission analysis (night viewer)

Analysis of the junction destruction by photograph emission detection
Analysis of the oxidization film (insulated film) destruction by photograph emission detection
Analysis used the LSI tester together

SEM observation

Observation of surface from using the secondary electronic image (inclination observation is possible)
Length measurement between 2 points

XMA Analysis

Qualitative analysis, (foreign substances, etc)
Observation of foreign substances distribution situation（Plane / Line analysis）

RIE Processing

Isotropic etching of silicone compounds
Removal of epoxy coverage (Thin film)

Chemical Treatment

Chemistry etching using chloride, sulfuric acid, nitric acid, and aqua regia

Cross-sectional Analysis

Section, Polish, and Sectional observation of Products / tips
Horizontal section polish and Sectional observation of CSP / Flip chip（After resin embedded processing）

Circuit and Logic Simulation

Presumption of the internal fault part from electric failure condition
Correlation verification of internal fault and electric failure condition
Circuit Restoration (*1)

Analysis View

Presumption of the cause of failure
Report Creation